Rising TPU Demand and CoWoS Constraints Put Intel in a Strong Upside Position 📊As external demand for TPUs accelerates, Google may further diversify its manufacturing pipeline to reduce supply‑chain risks — a development that opens up meaningful opportunities for Intel’s (INTC) foundry business.
December 01, 2025 07:29
Reports suggest that due to TSMC’s ongoing CoWoS capacity bottlenecks, Google is evaluating Intel’s next‑generation packaging technologies for its upcoming TPU v9. At the same time, the continued CoWoS constraints have turned Intel’s Foveros and embedded multi‑chip packaging solutions into viable and competitive alternatives over the past year.
From a trading perspective, the $37 area could offer an attractive entry level for building long exposure on INTC.
